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RedCap: Augmenting 5G to Support IoT Device Growth

Special Report: Sensors and AFEs

Bringing High Power Density to Energy Harvesting

Adopting AI-Based Circuit Optimization and Migration

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Heterogeneous 2

Heterogeneous 2.5/3D Chip Design Requires Integrated Tools

Siemens’ Xpedition Substrate Integrator provides co-design prototyping and planning of 2.5/3D chips.

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Editor's Choice

The Ins and Outs of Frequency Spread Spectrum

The U.S. Before and After the CHIPS Act

Machine Learning

Why Today's AIs Still aren't Very Intelligent

Inside Electronics

Tackling Cybersecurity Issues in Embedded Systems

SEARCH FOR DATA SHEETS, PRICE, STOCK, AND PART STATUS OF ELECTRONIC COMPONENTS

Industry Insights

So…The First Stage of the K2-W Op Amp is Neither Balanced Nor Differential (Part 2)

So…The K2-W Analog Computer Op Amp Has Mad Scientists’ Fingerprints on It (Part 1)

A Brief History of Switching Power Supplies

IoT Laws Aim to Protect User Information and Mitigate Cybersecurity Threats

Buy vs. Build for Time-Critical Sensor Data Fusion

Technology Advancements

Solid-State EV Battery Charges Up to 80% in Just 9.8 Minutes

3D-Printed Electromagnet Yields Powerful Solenoid

A New Generation of GaN Power ICs Mimic Silicon MOSFETs

Lamborghini Unveils Electric Torque Vectoring System

Secure Industrial Network Connectivity Demo Uses Single-Pair Ethernet

Secure Industrial Network Connectivity Demo Uses SPE

Can I Power My Device with an Energy Harvester?

Hybrid Inverters: A Potential Power Alternative for EVs?

Chiplets connected via the Universal Chiplet Interconnect Express

Demonstrating the UCIe Chiplet Interconnect

Products and Solutions

How RF FDAs Enhance Test Systems with RF Sampling ADCs

Tradeoffs in Analog Front-End Architectures for Power Applications

Mobile SoC Platform Incorporates Generative AI Acceleration

Mobile SoC Platform Incorporates Generative AI Acceleration

Noise Robust Edge AI Development Kit Addresses High-Voltage Applications

Smart Robot Demo Highlights Noise-Robust Edge-Computing Solution

Analog

The Building Blocks of Smart Factories

Ultra-Compact, 1.2/2.3-kV Gate Drivers Reveal Important Green Power Industry Trends

Analog Fundamentals Book Plus Lab Kit Hits Kickstarter This Week

Embedded

Arm Bets Big on AI with New Mobile CPU Cores

CC-Link IE TSN Helps Unlock the Smart Factory’s Potential

Sponsored Content

High-Performance Edge Computing with PICMG COM-HPC: A Virtual Event Series

Automation

RS-485 Transceiver IC Offers Enhanced Speed, Protection

ROS 2 Communication Stack: The Alternative Protocol

Celebrate Star Wars Days with Some of Its Best Tech

Building Automation: Extreme Comfort with Hidden Threats

Power

Test & Measurement

How to Accelerate Electric-Motor Drive Control Testing

EC Fans Make Cooling More Efficient and Sustainable

Automotive LDO Handles 40-V Inputs, Delivers Single-Digit Outputs

ROHM Stakes Claim to the Lowest-Power Op Amp

Power Protection

11 Myths About E-Fuse Circuit Protection

Power-Saving DC Motor Pre-Driver Simplifies EMI Optimization

Communications

Everything Ethernet Everywhere

The Semiconductor Industry's Future Aligns with TSN

Community-Backed Open-Source Initiatives Help Unlock MCU Capabilities

Ubiquitous Ethernet and Its Many Protocols

Test & Measurement

Compact Scope Targets Rackmount, Automated Test Apps

Achieving Safety Through Sensing

Inertial Modules Equipped to Handle Functional Safety Up to ASIL B

The Ever-Evolving CAD Software Industry

Test & Measurement

Cost-Effective Platform Performs OTA Vehicle-in-the-Loop Testing

Tiny Accelerometer Offers Advanced Feature Set

Tiny Accelerometer Offers Advanced Feature Set